December 24-25, 2014, Wuhan, China
Submission Deadline: November 30, 2014
It is truly our honor to reach you for our upcoming-2014 2nd International Conference on Future Optical Materials and Circuit Design (FOMCD 2014), which will be published on TTP international journal-Applied Materials and Research(ISSN:1022-6680), and will be indexed by EI Compendex, Thomson ISI (ISTP) and other indexing services.
The first of this conference series (FOMCD 2012) was held on December 27-28, 2012, Xiamen, China. All accepted papers from this conference were published on Advanced Materials Research journal and had been indexed into EI Compendex.
The submission system is: http://www.fomcd-conf.com/cfp.htm
The submission Email is: firstname.lastname@example.org
Themes and Topics ( but not limited to)
(I) New Materials and Advanced Materials
(II) Manufacturing Processes and Systems
(III) Advanced Design Technology
(IV) Automation and Computer Engineering
(V) Computer Engineering Topics